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Remetal, remetal llc, carfal, AlN, aluminum nitride, ceramic substrate, metallized ceramic, ceramic package, direct bond copper, DBC copper, DBC, carbon fiber, ...
aluminum-silicon  carbon fiber aluminum  carfal  composite baseplate  copper molly  DBC copper  diamond aluminum  diamond composite  diamond copper  package baseplate  processor lid  remetal llc  silicon-aluminum 
www.remetal-llc.com - 2009-02-07
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hybrid circuits, direct bond copper hybrid circuits, high power hybrid circuits, thick-film hybrid circuit substrates
725016A0348-1  725016A0348-3  725016A0909  725016A1174-1  725016A1174-3  77C121545G001  77C713809G1  77C715547  77C715548  77C717756  77C720506  77C720755  77C723902  77C723910G001  77D609358  77D609528G1  77D610737  77D610878  Alden Scientific Corp.  Dynamic Hybrids  hybridcircuits 
www.hybridcircuit.com - 2009-02-06
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Specializing in design and packaging of power electronics systems
copper on ceramic  power electronics packaging  power substrates 
www.dchopkins-associates.com - 2009-02-07
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Stellar Industries Corp. sells to the Telecom, Biomedical, and Defense Industries for custom products and services. Stellars products include custom lapped and ...
copper-tungsten replacement  direct copper bond  electroformed copper  jet process  p-side down mounting  submount 
www.stellarind.com - 2009-02-06
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metal
free
dbc
aluminum
metallization
metalization
steel
sputtering
brazing
take
rock
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